ASML to ship 10 EUV tools in 2012
Josephine Lien, Taipei; Jessie Shen, DIGITIMES [Monday 16 May 2011]
ASML has received 10 orders for its next-generation ultraviolet (EUV) lithography system – the NXE:3300 – with deliveries starting in 2012, according to the Dutch fab tool provider.
The orders were placed by logic IC and memory customers in Japan, Korea, Taiwan and the US, ASML said. The NXE:3300 series delivers improved performance in imaging, overlay and throughput, targeting volume production at the 22nm half-pitch node.
ASML revealed that for its previous-generation EUV platform – the NXE:3100 – a 0.25-NA production tool with a resolution of 27nm, the company has six orders in total with half of them already being fulfilled. The remaining three sets will be shipped by the end of 2011, the company added.
The NXE:3300 will deliver a throughput of up to 100 wafers per hour, compared to a maximum of 60 units that its predecessor reached, according to ASML.
Among Taiwan's DRAM chipmakers, Rexchip Electronics reportedly is so far the only player to order a set of EUV equipment. Others are still struggling to preserve cash needed to buy the tool, which costs as high as US$100 million.
Taiwan Semiconductor Manufacturing Company (TSMC) is among ASML's major clients, having placed an order for the NXE:3100, the foundry announced in early 2010.